Use of SiBN and SiBON Films Prepared by Plasma Enhanced Chemical Vapor Deposition from Borazine as Interconnection Dielectrics-Reference-Cited by-同舟云学术

Use of SiBN and SiBON Films Prepared by Plasma Enhanced Chemical Vapor Deposition from Borazine as Interconnection Dielectrics

Published:1997-02-01 Issue:2 Volume:144 Page:658-663
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:
Short-container-title:J. Electrochem. Soc.

Author:

Kane W. F.¹²,Cohen S. A.¹²,Hummel J. P.¹²,Luther B.¹²,Beach D. B.¹²

Affiliation:

1. IBM Research Division, T.J. Watson Research Center, Yorktown Heights, New York 10598

2. Oak Ridge National Laboratory, Chemical and Analytical Sciences Division, Oak Ridge, Tennessee 37831

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Link

https://iopscience.iop.org/article/10.1149/1.1837463/pdf

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