Electroless Nickel Plating onto Minute Patterns of Copper Using Ti(IV)∕Ti(III) Redox Couple-Reference-Cited by-同舟云学术

Electroless Nickel Plating onto Minute Patterns of Copper Using Ti(IV)∕Ti(III) Redox Couple

Published:2005 Issue:9 Volume:152 Page:C588
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

Yagi Shunsuke,Murase Kuniaki,Tsukimoto Susumu,Hirato Tetsuji,Awakura Yasuhiro

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference19 articles.

1. The Autocatalytic Deposition of Tin

2. Use of Ti(III) Complexes To Reduce Ni, Co, and Fe in Water Solutions

3. Development of Electroless Ni Plating Bath Using Ti (III) Ion Reductant.

4. S. Nakao, D. Kim, K. Obata, S. Inazawa, M. Majima, K. Koyama, and Y. Tani , Abstract 232, Abstracts of Frontiers of Surface Engineering 2001 (FSE 2001), Nagoya, Japan, Oct 28-Nov 1, 2001.

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