Facile galvanic replacement deposition of nickel on copper substrate in deep eutectic solvent and its activation ability for electroless Ni–P plating-Reference-Cited by-同舟云学术

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Facile galvanic replacement deposition of nickel on copper substrate in deep eutectic solvent and its activation ability for electroless Ni–P plating

Published:2022-04-19 Issue:5 Volume:26 Page:1313-1322
ISSN:1432-8488
Container-title:Journal of Solid State Electrochemistry
language:en
Short-container-title:J Solid State Electrochem

Author:

Hu Guanqun,Huang Rui,Wang Hongli,Zhao Qiuping,Zhang Xingkai^ORCID

Funder

National Natural Science Foundation of China

Youth Innovation Promotion Association of the Chinese Academy of Sciences

Science and Technology Planning Project of Lanzhou City

LICP Cooperation Foundation for Young Scholars

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Electrochemistry,Condensed Matter Physics,General Materials Science

Link

https://link.springer.com/content/pdf/10.1007/s10008-022-05172-4.pdf

Reference33 articles.

1. Azar GTP, Fox D, Fedutik Y, Krishnan L, Cobley AJ (2020) Functionalised copper nanoparticle catalysts for electroless copper plating on textiles. Surf Coat Technol 396:125971

2. Wei XF, Zhu QS, Guo JD, Shang JK (2021) Obtaining ultra-high throwing power in Cu electroplating of flexible printed circuit by fast consumption of a suppressor. J Solid State Electrochem. https://doi.org/10.1007/s10008-021-05055-0

3. Huang H, Guo X, Bu F, Huang G (2020) Corrosion behavior of immersion silver printed circuit board copper under a thin electrolyte layer. Eng Failure Anal 117:104807

4. Tian R, Tian Y, Huang Y, Yang D, Chen C, Sun H (2021) Comparative study between the Sn-Ag-Cu/ENIG and Sn-Ag-Cu/ENEPIG solder joints under extreme temperature thermal shock. J Mater Sci Mater Electron 32:6890–6899

5. Liu Y, Chen C, Kim D, Zhang Z, Long X, Suganuma K (2021) Modified Ni/Pd/Au-finished DBA substrate for deformation-resistant Ag-Au joint during long-term thermal shock test. J Mater Sci Mater Electron 32:20384–20393

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Cobalt layer prepared on copper using galvanic replacement as an alternative to palladium for activating electroless Ni–P plating;Journal of Applied Electrochemistry;2024-07-22

2. Cobalt layer prepared on copper using galvanic replacement as an alternative to palladium for activating electroless Ni-P plating;2024-04-24

3. Galvanic replacement deposited copper layer as an efficient activator to realize electroless Ni-P plating on aluminum;Journal of Solid State Electrochemistry;2024-04-11

4. Effect of Current Density on Magnetic and Hardness Properties of Ni-Cu Alloy Coated on Al via Electrodeposition;International Journal of Engineering;2024

5. Parameter optimization and performance study of Ni–P coatings prepared by pulse-assisted jet electrochemical deposition;Journal of Solid State Electrochemistry;2022-07-25

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