Author:
Honda Yuki,Hagiwara Kei,Goto Masahide,Watabe Toshihisa,Nanba Masakazu,Iguchi Yoshinori,Saraya Takuya,Kobayashi Masaharu,Toshiyoshi Hiroshi,Higurashi Eiji,Hiramoto Toshiro
Abstract
A 3D structured CMOS image sensor that can process signals pixel-wise in parallel is investigated as a means to simultaneously increase the pixel count and the frame rate. To make the pixel pitch finer, the Au electrode dimension is reduced to a 6-μm pitch that is electrically interconnected using a direct-bonding technique. We also develop a daisy-chain test device to examine the numerous interconnections. The experimental results show that the series of electrical interconnections exceeds 230,000 contacts, with the Au contact resistance for a single connection being ~23.6 mΩ.
Publisher
The Electrochemical Society
Cited by
6 articles.
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