Stress Corrosion Cracking of Cu Interconnects during CMP with a Cu/Porous Low-k Structure-Reference-Cited by-同舟云学术

Stress Corrosion Cracking of Cu Interconnects during CMP with a Cu/Porous Low-k Structure

Published:2005 Issue:6 Volume:152 Page:G506
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

Kodera Masako,Uekusa Shin-ichiro,Nagano Hidekazu,Tokushige Katsuhiko,Shima Shohei,Fukunaga Akira,Mochizuki Yoshihiro,Fukuda Akira,Hiyama Hiroyuki,Tsujimura Manabu,Nagai Hirokuni,Maekawa Kaoru

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference18 articles.

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3. C. Golgberg, L. Mercado, S. Filipiak, and S. Crown , inProceedings of the 2002 Interconnect Technology Conference, San Francisco, CA, pp. 209-211 (2002).

4. S. Ogawa, T. Nasuno, M. Egami, and A. Nakashima , inProceedings of the 2002 Interconnect Technology Conference, San Francisco, CA, pp. 220-222 (2002).

5. M. Nagai, K. Maekawa, M. Iwashita, M. Muramatsu, K. Kubota, K. Hinata, T. Kokubo, A. Shiota, M. Hattori, H. Nagano, K. Tokushige, M. Kodera, and M. Mishima , inProceedings of the 2004 International Interconnect Technology Conference, pp. 145-147 (2004).

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