Abstract
As an inhibitor for copper (Cu), Octyl hydroxamic acid (OHA) has been extensively studied through a combination of density functional theory (DFT) and experiments. Our findings indicate that using a concentration of 3 mM OHA as an inhibitor can lead to a remarkable removal rate (RR) and surface quality when the pH is at 10. Tafel analysis of potentiodynamic polarization plots was performed to demonstrate that OHA can lower the corrosion current. Further insight into the adsorption behavior of OHA on the Cu surface was obtained through a comprehensive study combining X-ray photoelectron spectroscopy (XPS), DFT calculations, and adsorption isotherm model analysis.
Funder
the Major National Science and Technology Special Projects
the Key Project of Natural Science of Hebei Province Colleges and Universities
the National Natural Science Foundation of Hebei province
Publisher
The Electrochemical Society
Subject
Electronic, Optical and Magnetic Materials
Cited by
2 articles.
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