Improvements in FOMs and Thermal Effects of a III-V Compound Material Based Short-Channel Thin Film Junctionless Double Gate MOSFETs

Abstract

Better figure of merits (FOMs) have been achieved by using III-V compound material based junctionless double gate metal-oxide semiconductor field-effect transistors (JL DG-MOSFETs), and a thorough analysis of the device’s performance over temperature has been performed using a highly N-doped GaAs-based JL DG-MOSFET using III-V compound material GaSb. GaSb, a compound material, is employed as the source material, which is well known for its greater mobility and injection velocity property with GaAs as the channel and drain materials, to obtain more output current and less leakage current due to the development of hetero structure (GaSb-GaAs) at the source-channel interface. The dielectric material HfO2 with a high k value is utilized to reduce the gate tunneling effects of electrons and enhance the control of the gate at the 20 nm channel length. Primary and auxiliary gates are taken to include ipact ionization on drain side for reducing the Subthreshold-swing. Numerous characteristics of a DG JLMOSFET, such as Id, SS, gm, TGF, Ion/Ioff, Cgs, and fT, GFP, TFP, GTFP are explored and compared with a silicon based material. The proposed structure shows an improved results comparing to the earlier model with Id of 117 mA, SS of 15.08 mV decade−1, gm of 0.62 A V−1, TGF of 38.8 V−1, Ion/Ioff ratio of 1.89 × 10 13, Cgs of 5.86 × 10 −16 F, fT of 2.05 × 10 15 Hz, GTFP of 1.81 × 10 17 Hz/V for the improvement of FOM in RF and DC analysis.