Synergetic Effect of 1,2,4-triazole and Glycine on Chemical Mechanical Planarization of Aluminum at Low Polishing Pressure in an Eco-Friendly Slurry
Author:
Funder
National Natural Science Foundation of China
Publisher
The Electrochemical Society
Subject
Electronic, Optical and Magnetic Materials
Link
https://iopscience.iop.org/article/10.1149/2162-8777/ab7882/pdf
Reference58 articles.
1. Diffusion and Gate Replacement: A New Gate-First High- $k$ /Metal Gate CMOS Integration Scheme Suppressing Gate Height Asymmetry
2. Effect of Glycine and TT-LYK in Alkaline CMP Slurry on Controlling the Galvanic Corrosion at Al-Co Interface
3. Chemical Mechanical Polishing of Al-Co Films for Replacement Metal Gate Applications
4. CMP Solutions for the Integration of High-K Metal Gate Technologies
5. Process development of high-k metal gate aluminum CMP at 28nm technology node
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