The CORE Sequence: A Nanoscale Fluorocarbon-Free Silicon Plasma Etch Process Based on SF6/O2Cycles with Excellent 3D Profile Control at Room Temperature-Reference-Cited by-同舟云学术

The CORE Sequence: A Nanoscale Fluorocarbon-Free Silicon Plasma Etch Process Based on SF6/O2Cycles with Excellent 3D Profile Control at Room Temperature

Published:2020-01-08 Issue:2 Volume:9 Page:024002
ISSN:2162-8777
Container-title:ECS Journal of Solid State Science and Technology
language:
Short-container-title:ECS J. Solid State Sci. Technol.

Author:

Thi Hoang Nguyen Vy,Silvestre Chantal,Shi Peixiong,Cork Roy,Jensen Flemming,Hubner Jorg,Ma Kechun,Leussink Pele,de Boer Meint,Jansen Henri

Publisher

The Electrochemical Society

Subject

Electronic, Optical and Magnetic Materials

Link

https://iopscience.iop.org/article/10.1149/2162-8777/ab61ed/pdf

Reference78 articles.

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