Influence of Scavenger on Abrasive Stability Enhancement and Chemical and Mechanical Properties for Tungsten-Film Chemical- Mechanical-Planarization
Author:
Funder
Ministry of Trade, Industry and Energy
Publisher
The Electrochemical Society
Subject
Electronic, Optical and Magnetic Materials
Link
https://iopscience.iop.org/article/10.1149/2162-8777/ab9fe5/pdf
Reference30 articles.
1. Studies on passivation behavior of tungsten in application to chemical mechanical polishing
2. Effects of oxidants on the removal of tungsten in CMP process
3. Chemical mechanical polishing and electrochemical characteristics of tungsten using mixed oxidizers with hydrogen peroxide and ferric nitrate
4. W-CMP for sub-micron inverse metallisation
5. Electrical performances of low resistive W buried gate using B2H6-reduced W nucleation layer technology for 30nm-based DRAM devices
Cited by 10 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Synergetic Effect of Chemical Components in a Tungsten CMP Slurry and the Evolution of Tungsten Surface Species;ECS Journal of Solid State Science and Technology;2024-07-01
2. Research of dry tribochemical mechanical polishing SiC with an innovation abrasive-catalytic abrasive cluster;2023-04-14
3. Silicon Wafer CMP Slurry Using a Hydrolysis Reaction Accelerator with an Amine Functional Group Remarkably Enhances Polishing Rate;Nanomaterials;2022-11-04
4. Surface Transformation of Spin-on-Carbon Film via Forming Carbon Iron Complex for Remarkably Enhanced Polishing Rate;Nanomaterials;2022-03-15
5. Polymer link breakage of polyimide-film-surface using hydrolysis reaction accelerator for enhancing chemical–mechanical-planarization polishing-rate;Scientific Reports;2022-03-01
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3