Synergetic Effect of Chemical Components in a Tungsten CMP Slurry and the Evolution of Tungsten Surface Species

Abstract

A novel slurry containing 50 ppm Fe3+, 2 wt% H2O2, 75 ppm oxalic acid, and abrasive nano-silica particles were utilized in a W chemical mechanical planarization process. Using this slurry, a W material removal rate of 710 Å min−1 and surface roughness of 1 nm were achieved. According to X-ray photoelectron spectroscopy data, surface W was first transformed to WO2 via its dissolution in H2O2, and then Fe3+ ions serving as a catalyst promoted the conversion of tungsten to WO3 through the WO2 intermediate in the presence of H2O2. Oxalic acid was added to coordinate with H2O2 and thus improve the slurry stability through a “wrapping” mechanism without decreasing the W material removal rate. Scanning electron microscopy and atomic force microscopy observations revealed that the W surface morphology changed first from coarse elongated grains to a discontinuous structure after the uneven oxidation by H2O2 and then to a wrinkled soft surface by Fe3+ and H2O2. Finally, it was ground with abrasive nano-silica particles to achieve a high degree of flatness.