Study of Pattern Density Effects in CMP Using Fixed Abrasive Pads-Reference-Cited by-同舟云学术

Study of Pattern Density Effects in CMP Using Fixed Abrasive Pads

Published:2003 Issue:12 Volume:150 Page:G821
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

Gorantla Venkata R.,Venigalla Rajasekhar,Economikos Laertis,O’Connor Daniel R.,Babu S. V.

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference20 articles.

1. L. Peters,Semicond. Int.,1999(April).

2. J. Schlueter,Semicond. Int.,1999(Oct).

3. S. Wolf and R. N. Tauber,Silicon Processing for the VLSI Era, Vol. 1, p. 830, Lattice Press, CA (2000).

4. J. J. Gagliardi and T. Vo, inProceedings of the CMP-MIC Conference, IMIC, p. 373 (2000).

5. A. Romer, T. Donohue, J. J. Gagliardi, F. Weimar, P. Theime, and M. Hollatz, inProceedings of the CMP-MIC Conference, IMIC, p. 265, (2000).

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