Investigation of Galvanic Corrosion Between TaN[sub x] Barriers and Copper Seed by Electrochemical Impedance Spectroscopy-Reference-Cited by-同舟云学术

Investigation of Galvanic Corrosion Between TaN[sub x] Barriers and Copper Seed by Electrochemical Impedance Spectroscopy

Published:2007 Issue:10 Volume:10 Page:D100
ISSN:1099-0062
Container-title:Electrochemical and Solid-State Letters
language:en
Short-container-title:Electrochem. Solid-State Lett.

Author:

Hung Chi-Cheng,Lee Wen-Hsi,Wang Yu-Sheng,Chang Shih-Chieh,Wang Ying-Lang

Publisher

The Electrochemical Society

Subject

Electrical and Electronic Engineering,Electrochemistry,Physical and Theoretical Chemistry,General Materials Science,General Chemical Engineering

Reference42 articles.

1. D. Edelstein, J. Heidenreich, R. Goldblatt, W. Cote, C. Uzoh, N. Lustig, P. Roper, T. McDevitt, W. Motsiff, A. Simon, et al. , Technical Digest, IEEE International Electron Devices Meeting , 773 (1997).

2. Damascene copper electroplating for chip interconnections

3. Pattern-Dependent Copper Microcorrosion from CMP

4. Copper Photocorrosion Phenomenon during Post CMP Cleaning

5. Effect of pH on CMP of Copper and Tantalum

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Long-term in vitro corrosion behavior of Zn-3Ag and Zn-3Ag-0.5Mg alloys considered for biodegradable implant applications;Materials & Design;2022-01

2. Developing Integrated Solutions and Wet Cleans to Eliminate Tungsten Contact Attack in Sub 0x nm Nodes;Solid State Phenomena;2018-08

3. Electrochemical study on metal corrosion in chemical mechanical planarization process;Japanese Journal of Applied Physics;2017-06-26

4. Effect of tungsten incorporation in cobalt tungsten alloys as seedless diffusion barrier materials;Microelectronic Engineering;2017-03

5. Visualizing Nanoscale Distribution of Corrosion Cells by Open-Loop Electric Potential Microscopy;ACS Nano;2016-02-01