Author:
Lin Jeng-Yu,West Alan C.,Wan Chi-Chao
Publisher
The Electrochemical Society
Subject
Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials
Reference33 articles.
1. Effects of corrosion environments on the surface finishing of copper chemical mechanical polishing
2. Modification of the Preston equation for the chemical–mechanical polishing of copper
3. Hydroxyl Radical Formation in H[sub 2]O[sub 2]-Amino Acid Mixtures and Chemical Mechanical Polishing of Copper
4. M. Hariharaputhiran, S. Ramarajan, Y. Li, and S. V. Babu , inChemical-Mechanical Polishing-Fundamentals and Challenges, S. V. Babu , S. Danyluk , M. I. Krishnan , and M. Tsujimura , Editors, p. 129, Materials Research Society, San Francisco, CA (2000).
Cited by
14 articles.
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