Electrolyte composition and removal mechanism of Cu electrochemical mechanical polishing
Author:
Publisher
Springer Science and Business Media LLC
Subject
Metals and Alloys,General Engineering
Link
http://link.springer.com/content/pdf/10.1007/s11771-014-2170-6.pdf
Reference30 articles.
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2. LIU F Q, DU T B, DUBOUST A, TSAI S, HSU W Y. Cu planarization in electrochemical mechanical planarization [J]. Journal of The Electrochemical Society, 2006, 153(6): C377–C381.
3. LIN J Y, ALAN C W. Adsorption-desorption study of benzotriazole in a phosphate-based electrolyte for Cu electrochemical mechanical planarization [J]. Electrochimica Acta, 2010, 55(7): 2325–2331.
4. HONG Y, ROY D, BABU S V. Ammonium dodecyl sulfate as a potential corrosion inhibitor surfactant for electrochemical mechanical planarization of copper [J]. Electrochemical and Solid-State Letters, 2005, 8(11): G297–G300.
5. LIN J Y, WEST A C, WAN C C. Adsorption and desorption studies of glycine and benzotriazole during Cu oxidation in a chemical mechanical polishing bath [J]. Journal of The Electrochemical Society, 2008, 155(6): H396–H400.
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1. An Efficient Electrochemical Polishing Method with Planarization Ability Employing Solid and Liquid Electrolytes;Journal of The Electrochemical Society;2022-06-01
2. The Effect of Hydroxyethylidene Diphosphonic Acid on the Chemical Mechanical Polishing of Cobalt in H2O2 Based Alkaline Slurries;ECS Journal of Solid State Science and Technology;2020-03-26
3. On the reaction mechanism of a hydroxyethylidene diphosphonic acid-based electrolyte for electrochemical mechanical polishing of copper;Electrochemistry Communications;2019-06
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