Influence of CMP Slurries and Post-CMP Cleaning Solutions on Cu Interconnects and TDDB Reliability-Reference-Cited by-同舟云学术

Influence of CMP Slurries and Post-CMP Cleaning Solutions on Cu Interconnects and TDDB Reliability

Published:2008 Issue:7 Volume:155 Page:H485
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

Yamada Yohei,Konishi Nobuhiro,Noguchi Junji,Jimbo Tomoko

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference12 articles.

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3. W. Wen, D. Xiaodong, and J. S. Yuan , inInternational Reliability Physics in Symposium, p. 282, IEEE, Piscataway, NJ (2003).

4. N. Miura, J. Noguchi, K. Omori, T. Jimbo, H. Aoki, and T. Tamaru , in18th International VLSI Multilevel Interconnection Conference, p. 143, IMIC, Santa Clara, CA (2001).

5. Zs. Tokei, V. Sutcliffe, S. Demuynck, F. Iacopi, P. Roussel, G. P. Beyer, R. J. O. M. Hoofman, and K. Maex , inInternational Reliability Physics in Symposium, p. 326, IEEE, Piscataway, NJ (2004).

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