Development of a Predictive and Preventive Maintenance Demonstration System for a Semiconductor Etching Tool

Author:

Lee Jay,Siegel David,Lapira Edzel Racsa

Abstract

Increasing yield, eliminating unexpected downtime, and reducing maintenance costs are some of the potential benefits that a predictive monitoring system can provide for semiconductor manufacturing. Prior to the implementation of a predictive based condition monitoring approach for critical semiconductor equipment and components, the technology requires further development and validation. A systematic approach for developing a predictive monitoring system is presented, including several key steps that include data pre-processing, feature extraction and selection, health assessment, and component lifetime prediction. The approach is demonstrated on a LAM 2300® Kiyo® conductor etch product, in which data was collected over an 8-month period from a GlobalFoundries Fab in Dresden, Germany. The methodology and predictive health models are demonstrated for an example component from the etching tool, the electrostatic chuck. Both trace signals and metrology data are evaluated for developing the health and prediction models for the electrostatic chuck. The health monitoring models provide a clear and increasing trend, in which the electrostatic health value can be tracked quite well over time. The systematic development framework shows promise and future works looks to further validate the prediction models, and in addition develop commercially viable implementation software from this work.

Publisher

The Electrochemical Society

Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3