1. A. N. Saxena, in
1984 Proceedings of the First International IEEE VLSI Multilevel Interconnection Conference
, New York, p. 1 (1984).
2. B. Trednnick, J. Lee, K. Holland, and T. Bibby, No. 96-ISMIC-100P, in
Proceedings of the First International Chemical Mechanical Polish (CMP) for VLSI/ULSI Multilevel Interconnection Conference
, CMP-MIC, p. 107 (1996).
3. The National Technology Roadmap for Semiconductors
, Semiconductor Industry Association, San Jose, CA (1997).
4. Elimination of Dielectric Degradation for Chemical-Mechanical Planarization of Low-kHydrogen Silisesquioxane