Investigation of the Kinetics of Tungsten Chemical Mechanical Polishing in Potassium Iodate‐Based Slurries: II. Roles of Colloid Species and Slurry Chemistry-Reference-Cited by-同舟云学术

Investigation of the Kinetics of Tungsten Chemical Mechanical Polishing in Potassium Iodate‐Based Slurries: II. Roles of Colloid Species and Slurry Chemistry

Published:1999-05-01 Issue:5 Volume:146 Page:1934-1938
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:
Short-container-title:J. Electrochem. Soc.

Author:

Stein David J.¹²,Hetherington Dale L.²,Cecchia Joseph L.¹

Affiliation:

1. Department of Chemical and Nuclear Engineering, University of New Mexico, Albuquerque, New Mexico 87131, United States of America

2. Sandia National Laboratories, Microelectronics Development Laboratory, Albuquerque, New Mexico 87185-5800, United States of America

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Link

https://iopscience.iop.org/article/10.1149/1.1391869/pdf

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