Study on Chemical Mechanical Polishing Performances of Sapphire Wafer (0001) Using Silica-Based Slurry-Reference-Cited by-同舟云学术

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Study on Chemical Mechanical Polishing Performances of Sapphire Wafer (0001) Using Silica-Based Slurry

Published:2017 Issue:10 Volume:6 Page:P723-P727
ISSN:2162-8769
Container-title:ECS Journal of Solid State Science and Technology
language:en
Short-container-title:ECS J. Solid State Sci. Technol.

Author:

Zhang Zefang,Zhang Wenjuan,Zhang Shanduan,Yan Weixia

Funder

National Natural Science Foundation of China (NSFC)

Publisher

The Electrochemical Society

Subject

Electronic, Optical and Magnetic Materials

Reference19 articles.

1. Two-Step Chemical Mechanical Polishing of Sapphire Substrate

2. Effect of Abrasive Concentration on Chemical Mechanical Polishing of Sapphire

3. The Effect of pH on Sapphire Chemical Mechanical Polishing

4. Preparation of Fe-doped colloidal SiO_2 abrasives and their chemical mechanical polishing behavior on sapphire substrates

5. Alumina Abrasives for Sapphire Substrate Polishing

Cited by 16 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Machining performance and material removal mechanism of sapphire with novel polishing slurry;Applied Surface Science;2024-10

2. Study on the polishing performance and mechanism of sapphire wafers by different types of degradable surfactants;Surfaces and Interfaces;2024-09

3. Efficient integration of electro-coagulation and ceramic membranes for the treatment of real chemical mechanical polishing (CMP) slurry wastewater from the semiconductor industry;Journal of Water Process Engineering;2024-05

4. Nanomaterials and Equipment for Chemical–Mechanical Polishing of Single-Crystal Sapphire Wafers;Coatings;2023-12-14

5. Effects of Surfactants on the Chemical Mechanical Polishing Performance of a-Plane Sapphire Substrates;ECS Journal of Solid State Science and Technology;2023-09-01

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