Enhancement of Cu(hfac)[sub 2] Chemisorption on the Parylene Surface by N[sub 2] Plasma Surface Modification-Reference-Cited by-同舟云学术

Enhancement of Cu(hfac)[sub 2] Chemisorption on the Parylene Surface by N[sub 2] Plasma Surface Modification

Published:2007 Issue:10 Volume:154 Page:G215
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

Pimanpang S.,Wang Pei-I,Ye Dexian,Juneja Jasbir S.,Wang G.-C.,Lu T.-M.

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference19 articles.

1. J. B. Fortin and T.-M. Lu ,Chemical Vapor Deposition Polymerization: The Growth and Properties of Parylene Thin Films, Kluwer Academic Publishers, Norwell, MA (2004).

2. Mass spectrometry study during the vapor deposition of poly-para-xylylene thin films

3. Molecular Caulking

4. Pressure dependent Parylene-N pore sealant penetration in porous low-κ dielectrics

5. Interfacial interaction ofin situCu growth on tetrasulfide self-assembled monolayer on plasma treated parylene surface

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