Author:
Au Yeung,Lin Youbo,Kim Hoon,Beh Eugene,Liu Yiqun,Gordon Roy G.
Publisher
The Electrochemical Society
Subject
Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials
Reference20 articles.
1. An introduction to Cu electromigration
2. Effect of metal liner on electromigration in Cu Damascene lines
3. E. Nakazawa, K. Arita, Y. Tsuchiya, Y. Kakuhara, S. Yokogawa, T. Kurokawa, N. Sasaki, S. Ganguli, H. C. Ha, W. T. Lee, et al. , inAdvanced Metallization Conference 2008 XXIV, p. 419 (2008).
4. Electromigration of Cu/low dielectric constant interconnects
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