Galvanic Corrosion Inhibitors for Cu/Ru Couple during Chemical Mechanical Polishing of Ru-Reference-Cited by-同舟云学术

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Galvanic Corrosion Inhibitors for Cu/Ru Couple during Chemical Mechanical Polishing of Ru

Published:2016-12-30 Issue:1 Volume:6 Page:P62-P67
ISSN:2162-8769
Container-title:ECS Journal of Solid State Science and Technology
language:en
Short-container-title:ECS J. Solid State Sci. Technol.

Author:

Cheng Jie,Wang Tongqing,Lu Xinchun

Funder

Science Fund for Creative Research Groups (Fund for Creative Research Groups)

National Natural Science Foundation of China (NSFC)

National Basic Research Program of China

Publisher

The Electrochemical Society

Subject

Electronic, Optical and Magnetic Materials

Reference34 articles.

1. Direct-on-barrier copper electroplating on ruthenium from the ionic liquid 1-ethyl-3-methylimidazolium dicyanamide

2. Diffusion Studies of Copper on Ruthenium Thin Film

3. Improved barrier properties of ultrathin Ru film with TaN interlayer for copper metallization

4. Investigation of Percarbonate Based Slurry Chemistry for Controlling Galvanic Corrosion during CMP of Ruthenium

5. Controlling the Galvanic Corrosion of Copper during Chemical Mechanical Planarization of Ruthenium Barrier Films

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1. Corrosion inhibitors in H2O2 system slurry for Ru based barrier layer Cu interconnect chemical mechanical polishing and optimization;Colloids and Surfaces A: Physicochemical and Engineering Aspects;2024-11

2. Experimental Strategies for Studying Tribo-Electrochemical Aspects of Chemical–Mechanical Planarization;Lubricants;2024-02-19

3. Diethylenetriamine and serine as synergists used in FA/OII based alkaline solution to realize enhanced cleaning efficiency of the organic corrosion inhibitor;Colloids and Surfaces A: Physicochemical and Engineering Aspects;2023-10

4. Materials Quest for Advanced Interconnect Metallization in Integrated Circuits;Advanced Science;2023-06-15

5. Role of Diethylene Triaminepentaacetic Acid Pentapotassium Salt on Ruthenium CMP in H₂O₂-Based Slurries;ECS Journal of Solid State Science and Technology;2022-12-01

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