Simulation of Particle Adhesion: Implications in Chemical Mechanical Polishing and Post Chemical Mechanical Polishing Cleaning

Author:

Cooper Kevin,Gupta Anand,Beaudoin Stephen

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference25 articles.

1. Simulation of the Adhesion of Particles to Surfaces

2. Analysis of Contact Interactions between a Rough Deformable Colloid and a Smooth Substrate

3. Substrate Morphology and Particle Adhesion in Reacting Systems

4. Simultaneous Temperature Measurement of Wafers in Chemical Mechanical Polishing of Silicon Dioxide Layer

5. T. C. Tsai, P. H. Lo, F. L. Jaung, C. Chung, C. Y. Lee, E. Hsu, and L. M. Liu, inProcess Physics and Modeling in Semiconductor Technology, C. S. Murthy, G. R. Srinivasan, and S. T. Dunham, Editors, PV 99-2, p. 1246, The Electrochemical Society Proceedings Series, Pennington, NJ (1999).

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