1. International Technology Roadmap for Semiconductors (2001).
2. J. Yota, M. Janani, L. E. Camilletti, A. Kar-Roy, Q. Z. Liu, C. Nguyen, and M. D. Woo , in
Proceedings of the 2000 International Interconnect Technology Conference
, p. 76, San Francisco, CA (2000).
3. P. Xu, K. Huang, A. Patel, S. Rathi, B. Tang, J. Ferguson, J. Huang, C. Ngai, and M. Loboda , in
Proceedings of the 1999 International Interconnect Technology Conference
, p. 109, San Francisco, CA (1999).
4. New solutions for intermetal dielectrics using trimethylsilane-based PECVD processes
5. Low Dielectric Constant 3MS α-SiC:H as Cu Diffusion Barrier Layer in Cu Dual Damascene Process