Review—The Mediating Effect of Chemically Oxidized Silicon Surface on the P4VP Electrografting for Silicon Electrical Insulation
Author:
Publisher
The Electrochemical Society
Subject
Electronic, Optical and Magnetic Materials
Reference40 articles.
1. Handbook of 3D Integration
2. Three-dimensional silicon integration
3. Study on TSV isolation liners for a Via Last approach with the use in 3D-WLP for MEMS
4. Copper filled TSV formation with Parylene-HT insulator for low-temperature compatible 3D integration
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1. In situ synthesis of a highly cross-linked polymethacrylimide ultrathin film on a silicon wafer with applicable dielectric, thermal, and mechanical properties;Thin Solid Films;2020-10
2. Electroless Grafting of Polymer Insulation Layers in Through-Silicon Vias;ECS Journal of Solid State Science and Technology;2019
3. Design of thermally stable insulation film by radical grafting poly(methylacrylic acid) on silicon surface;Applied Surface Science;2019-01
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