Author:
Holl S. L.,Colinge C. A.,Hobart K. D.,Kub F. J.
Publisher
The Electrochemical Society
Subject
Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials
Reference7 articles.
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3. Room Temperature Wafer Bonding Using Oxygen Plasma Treatment in Reactive Ion Etchers With and Without Inductively Coupled Plasma
4. Growth of ultrathin SiO2 on Si by surface irradiation with an O2+Ar electron cyclotron resonance microwave plasma at low temperatures
5. K. Hobart, F. Kub, C. Colinge, and G. Ayele , inSemiconductor Wafer Bonding VII: Science, Technology, and Applications, S. Bengtsson , H. Baumgart , C. E. Hont , and T. Suga , Editors, PV 2003–19, p. 137, The Electrochemical Society Proceedings Series, Pennington, NJ (2003).
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