Publisher
The Electrochemical Society
Cited by
2 articles.
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1. Effect of Die Thickness on the Reliability of Solder Joint in Clip-bonded Packages;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07
2. Automated image analysis for evaluation of wafer backside chipping;The International Journal of Advanced Manufacturing Technology;2018-08-30