Author:
Yeh Jia-Bin,Perng Dung-Ching,Hsu Kuo-Chung
Publisher
The Electrochemical Society
Subject
Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials
Reference33 articles.
1. A. Kajita, T. Usui, M. Yamada, E. Ogawa, T. Katata, A. Sakata, H. Miyajima, A. Kojima, R. Kanamura, Y. Ohoka, et al. , inProceedings of the IEEE International Interconnect Technology Conference, p. 9 (2003).
2. Comparison of the diffusion barrier properties of chemical‐vapor‐deposited TaN and sputtered TaN between Cu and Si
3. Evaluation of single- and multilayered amorphous tantalum nitride thin films as diffusion barriers in copper metallization
4. Effect of a thin ionized-metal-plasma deposited Cu layer on the properties and thermal stability of Cu-TaN-SiO/sub 2/-Si structures
5. Diffusion Studies of Copper on Ruthenium Thin Film
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