Measurement Method for Adhesion Forces between Polyvinyl Acetal Brushes and Flat Surfaces
Author:
Publisher
The Electrochemical Society
Subject
Electronic, Optical and Magnetic Materials
Reference36 articles.
1. Review on copper chemical–mechanical polishing (CMP) and post-CMP cleaning in ultra large system integrated (ULSI)—An electrochemical perspective
2. Keswani M. Han Z. , Developments in Surface Contamination and Cleaning, 8, Kohli R. Mittal K.L. , Editor, P. 156, Elsevier, Amsterdam (2015).
3. Investigation of eccentric PVA brush behaviors in post-Cu CMP cleaning
4. Frictional Analysis of Various Poly(vinyl alcohol) Brush Roller Designs for Post-Interlevel Dielectric CMP Scrubbing Applications
5. Comparison of Interfacial Forces During Post-Chemical-Mechanical-Polishing Cleaning
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1. Physical Wet Cleaning Technology for Semiconductor Devices;JAPANESE JOURNAL OF MULTIPHASE FLOW;2023-06-15
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3. Effect of brush cleaning on defect generation in post copper CMP;Microelectronic Engineering;2022-05
4. Effect of Skin Layer on Brush Loading, Cross-Contamination, and Cleaning Performance during Post-CMP Cleaning;ECS Journal of Solid State Science and Technology;2022-05-01
5. Static and dynamic interaction between polyvinyl acetal brushes and flat surfaces—Measuring near-surface brush volume ratio and nodule volume change for moving brushes;Microelectronic Engineering;2022-02
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