Simulation of Chemical Downstream Etch Systems: Correlation of the Effects of Operating Conditions on Wafer Etch Rate and Uniformity-Reference-Cited by-同舟云学术

Simulation of Chemical Downstream Etch Systems: Correlation of the Effects of Operating Conditions on Wafer Etch Rate and Uniformity

Published:1997-04-01 Issue:4 Volume:144 Page:1514-1521
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:
Short-container-title:J. Electrochem. Soc.

Author:

Vosen S. R.¹,Meeks E.¹,Larson R. S.¹,Shon J. W.¹

Affiliation:

1. Sandia National Laboratories, Livermore, California 94551‐0969

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Link

https://iopscience.iop.org/article/10.1149/1.1837620/pdf

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