Electrochemical Studies of W Corrosion for Low Resistive Contact in the 28 nm Technology Node-Reference-Cited by-同舟云学术

Electrochemical Studies of W Corrosion for Low Resistive Contact in the 28 nm Technology Node

Published:2011 Issue:2 Volume:159 Page:H162-H165
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

Hsu Chia-Lin,Perng Dung-Ching,Chen Yen-Ming,Huang Shu-Min,Li Yu-Ting,Kung Chang-Hung,Chih-Hsun Lin,Yang Yu-Ru,Lin Chin-Fu,Huang Climbing,Wu J. Y.

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference7 articles.

1. Pulsed CVD-W Nucleation Layer Using WF[sub 6] and B[sub 2]H[sub 6] for Low Resistivity W

2. Advanced tungsten plug process for beyond nanometer technology

3. Novel Contact-Plug Process with Low-Resistance Nucleation Layer Using Diborane-Reduction Tungsten Atomic-Layer-Deposition Method for 32 nm Complementary Metal–Oxide–Semiconductor Devices and Beyond

4. Low resistance W-contact for 32-nm node devices and beyond

5. A Comparative Study of the Atomic-Layer-Deposited Tungsten Thin Films as Nucleation Layers for W-Plug Deposition

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Promoting High-Temperature Oxygen Evolution Reaction via Infiltration of PrCoO_3−δ Nanoparticles;ACS Applied Energy Materials;2022-09-15

2. Study on Abnormally Accelerated Oxidation of Tungsten Plugs during Tungsten Chemical Mechanical Polishing in Semiconductor Manufacturing;ECS Journal of Solid State Science and Technology;2021-06-01

3. Co and CoTi x for contact plug and barrier layer in integrated circuits;Microelectronic Engineering;2018-04

4. Electrochemical mechanism of layout-dependent corrosion of tungsten in contact plugs;Materials Science in Semiconductor Processing;2014-04

5. Optimization of M1 to Contact Connection in Sub-40nm Node;ECS Transactions;2013-03-08