Bottom-up Filling of TSV-Scaled Trenches by Using Step Current Electrodeposition-Reference-Cited by-同舟云学术

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Bottom-up Filling of TSV-Scaled Trenches by Using Step Current Electrodeposition

Published:2015-08-06 Issue:10 Volume:4 Page:D31-D34
ISSN:2162-8726
Container-title:ECS Electrochemistry Letters
language:en
Short-container-title:ECS Electrochemistry Letters

Author:

Kim H. C.,Kim M. J.,Seo Y.,Lee Y.,Choe S.,Kim Y. G.,Cho S. K.,Kim J. J.

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Fuel Technology

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electrodeposition of Ru on Nanoscale Trench Patterns;ECS Journal of Solid State Science and Technology;2024-05-01

2. Tuning formation process of void defects in microcolumn arrays via pulse reverse electrodeposition;Journal of Materials Research and Technology;2023-05

3. Competitive adsorption between bromide ions and bis(3-sulfopropyl)-disulfide for Cu microvia filling;Electrochimica Acta;2021-02

4. Polyethylene Glycol-Based Single Organic Additive for Through Silicon Via Filling and its Structural Modification Effect;Journal of The Electrochemical Society;2021-01-01

5. Superconformal Deposition;Surface and Interface Science;2020-01-17

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