Author:
Volov Igor,Saito Tadashi,West Alan C.
Publisher
The Electrochemical Society
Subject
Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials
Reference45 articles.
1. P. Andricacos, D. S. Chung, H. Deligianni, J. E. Fluegel, K. T. Kwietniak, P. S. Locke, D. D. Restaino, S. C. Seo, P. M. Vereecken, and E. G. Walton ,Void-Free Damascene Copper Deposition Process and Means of Monitoring Thereof, IBM Corp., United States, 7678258 (2010).
2. Via-filling using electroplating for build-up PCBs
3. T. Osaka, M. Hasegawa, M. Yoshino, and N. Yamachika ,Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications, p. 183, (Springer Science & Business Media, LLC, New York, USA, 2009).
4. Damascene copper electroplating for chip interconnections
Cited by
12 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献