Electrochemical Processes for ULSI Interconnects
Author:
Publisher
Springer New York
Link
http://link.springer.com/content/pdf/10.1007/978-0-387-95868-2_13.pdf
Reference89 articles.
1. Andricacos, P. C.; Uzoh, C.; Dukovic, J. O.; Horkans, J.; and Deligianni, H.: Damascene copper electroplating for chip interconnections. IBM J. Res. Dev. 42, 567 (1998)
2. Andricacos, P. C.: Copper on-chip interconnections. The Electrochem. Soc. Interface 8, 32 (1999)
3. Ismail, Y. I.; Friedman, E. G.; and Neves, J. L.: Exploiting the on-chip inductance in high-speed clock distribution networks. IEEE Trans Very Large Scale Integr (VLSI) Syst. 9, 963 (2001)
4. Deutsch, A.; Kopcsay, G. V.; Coteus, P. W.; Surovic, C. W.; Dahlen, P. E.; Heckmann, D. L.; and Duan, D. W.: Frequency-dependent losses on high-performance interconnections. IEEE Trans. Electromagn. Compat. 43, 446 (2001).
5. Ismail, Y. I.; Friedman, E. G.; and Neves, J. L.: Repeater insertion in tree structured inductive interconnect. IEEE Trans. Circuits Syst. II-Analog Digital Signal Process 48, 471 (2001)
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