Aggressive Diamond Characterization and Wear Analysis during Chemical Mechanical Planarization-Reference-Cited by-同舟云学术

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Aggressive Diamond Characterization and Wear Analysis during Chemical Mechanical Planarization

Published:2012-12-05 Issue:1 Volume:2 Page:P36-P41
ISSN:2162-8769
Container-title:ECS Journal of Solid State Science and Technology
language:en
Short-container-title:ECS J. Solid State Sci. Technol.

Author:

Wu Changhong,Zhuang Yun,Liao Xiaoyan,Jiao Yubo,Sampurno Yasa Adi,Theng Siannie,Sun Fred,Naman Ananth,Philipossian Ara

Publisher

The Electrochemical Society

Subject

Electronic, Optical and Magnetic Materials

Reference13 articles.

1. Investigation of a Novel Diamond Disk's Effect on Pad Topography in Oxide Chemical Mechanical Polishing

2. Effect of CMP conditioner diamond shape on pad topography and oxide wafer performances

3. Analyses of Diamond Disk Substrate Wear and Diamond Microwear in Copper Chemical Mechanical Planarization Process

4. Alternative Optimization Techniques for Shallow Trench Isolation and Replacement Gate Technology Chemical Mechanical Planarization

5. Liao Y. , 2008 International Conference on Planarization/CMP Technology proceeding, p. 11 (2008).

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of Structures with Structured Surface Pad on Material Removal Rate in Chemical Mechanical Polishing;ECS Journal of Solid State Science and Technology;2024-08-01

2. Electrochemical surface rehydrogenation of boron-doped diamond electrodes after electrochemical polishing;Diamond and Related Materials;2023-06

3. Effect of conditioner disc wear on frictional, thermal, kinetic and pad micro-textural attributes of interlayer dielectric and tungsten chemical mechanical planarization;Japanese Journal of Applied Physics;2020-06-02

4. Residual Stress and Pop-Out Simulation for TSVs and Contacts in Via-Middle Process;IEEE Transactions on Semiconductor Manufacturing;2017-05

5. Cobalt CMP Development for 7nm Logic Device;ECS Transactions;2017-04-26

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