Analyses of Diamond Disk Substrate Wear and Diamond Microwear in Copper Chemical Mechanical Planarization Process-Reference-Cited by-同舟云学术

Analyses of Diamond Disk Substrate Wear and Diamond Microwear in Copper Chemical Mechanical Planarization Process

Published:2010 Issue:3 Volume:157 Page:H250
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

Meled Anand,Zhuang Yun,Wei Xiaomin,Cheng Jiang,Sampurno Yasa Adi,Borucki Leonard,Moinpour Mansour,Hooper Don,Philipossian Ara

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference6 articles.

1. K. Teo, K. Lim, K. C. Loh, L. Zazzera, and S. Balakumar , inProceedings of the CMP-MIC, Institute for Microelectronics on Chip Inter Connection, p. 377 (2006).

2. S. McGregor, M. Bubnick, T. Namola, K. Torrance, and R. Wielonski , inProceedings of the CMP-MIC, Institute for Microelectronics on Chip Inter Connection, p. 605 (2006).

3. Wear-corrosion properties of diamond conditioners in CMP slurry

4. CMP Active Diamond Characterization and Conditioner Wear

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