Bis-(sodium sulfoethyl)-disulfide: A Promising Accelerator for Super-conformal Copper Electrodeposition with Wide Operating Concentration Ranges-Reference-Cited by-同舟云学术

Bis-(sodium sulfoethyl)-disulfide: A Promising Accelerator for Super-conformal Copper Electrodeposition with Wide Operating Concentration Ranges

Published:2020-03-11 Issue:4 Volume:167 Page:042508
ISSN:1945-7111
Container-title:Journal of The Electrochemical Society
language:
Short-container-title:J. Electrochem. Soc.

Author:

Li Zhen,Tan Baizhao,Shi Minghao,Luo Jiye^ORCID,Hao Zhifeng,He Jun,Yang Guannan,Cui Chengqiang

Funder

Local Innovative and Research Teams Project of Guangdong Pearl River Talents Program

National Natural Science Foundation of China

One-hundred Young Talents of Guangdong University of Technology

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Link

https://iopscience.iop.org/article/10.1149/1945-7111/ab7b85/pdf

Reference39 articles.

1. Copper Electrodeposition for Nanofabrication of Electronics Devices

2. Damascene copper electroplating for chip interconnections

3. Via-filling using electroplating for build-up PCBs

4. Effect of External Factors on Copper Filling in 3D Integrated Through-Silicon-Vias (TSVs)

5. Curvature Enhanced Adsorbate Coverage Model for Electrodeposition

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