Erratum: Self-Assembled Nano-Stuffing Structure in CVD and ALD Co(W) Films as a Single-Layered Barrier/Liner for Future Cu-Interconnects [ECS J. Solid State Sci. Technol.,2, P471 (2013)]
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Published:2014
Issue:7
Volume:3
Page:X1-X2
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ISSN:2162-8769
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Container-title:ECS Journal of Solid State Science and Technology
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language:en
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Short-container-title:ECS J. Solid State Sci. Technol.
Author:
Shimizu Hideharu,Kumamoto Akihito,Shima Kohei,Kobayashi Yoshihiko,Momose Takeshi,Nogami Takeshi,Shimogaki Yukihiro
Publisher
The Electrochemical Society
Subject
Electronic, Optical and Magnetic Materials
Cited by
1 articles.
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