(Invited) Electrical Characterization and Reliability Assessment of Double-Gate FinFETs

Abstract

The performance and reliability of doped and undoped (100)<100> and (110)<110> sidewall silicon-on-insulator (SOI) FinFETs with an Hf-based gate dielectric were evaluated. The electron mobility of the (110) FinFET sidewall is comparable to the (100) FinFET sidewall devices, which is opposite of the typical planar MOSFET electron mobility dependence on orientation, wherein (110) degrades significantly. In addition, TiN metal gate-induced strain cannot completely explain the similarity in (110) and (100) electron mobility because, although lower in magnitude, the two orientations with polysilicon electrodes resulted in similar mobility values. When investigating the orientation dependence of negative bias temperature instability (NBTI), (110) was found to cause more degradation than (100), and FinFETs with higher fin body doping demonstrated even more degradation.