Via-Hole-Type Flip-Chip Packaging to Improve the Thermal Characteristics and Reliability of Blue Light Emitting Diodes
Author:
Funder
National Research Foundation of Korea (NRF)
Publisher
The Electrochemical Society
Subject
Electronic, Optical and Magnetic Materials
Reference30 articles.
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3. Light-extraction enhancement of GaN-based 395 nm flip-chip light-emitting diodes by an Al-doped ITO transparent conductive electrode
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2. Selective Coating of White Silicone to Improve the Optical and Thermal Characteristics of White LED Packages;ECS Journal of Solid State Science and Technology;2020-07-22
3. Optimization of InGaN-based LED Package Structure for Automotive Adaptive Driving Beam Headlamp;ECS Journal of Solid State Science and Technology;2020-06-26
4. Effects of Ultraviolet Wavelength and Ambient Temperature on Reliability of Silicones in InAlGaN-Based Light-Emitting-Diode Package;ECS Journal of Solid State Science and Technology;2020-03-13
5. Improvement in the Reliability of AlGaInP-Based Light-Emitting Diode Package Using Optimal Silicone and Leadframe Structure;ECS Journal of Solid State Science and Technology;2019-11-12
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