Author:
Kwon Yongchai,Seok Jongwon,Lu Jian-Qiang,Cale Timothy S.,Gutmann Ronald J.
Publisher
The Electrochemical Society
Subject
Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials
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3. Wafer Bonding Using Dielectric Polymer Thin Films in 3D Integration
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