Aerosol Jet Printing of a Benzocyclobutene‐Based Ink as Adhesive Material for Wafer Bonding Application
Author:
Affiliation:
1. Department of Chemistry Materials and Chemical Engineering “Giulio Natta” Politecnico di Milano Piazza Leonardo da Vinci 32 Milan MI 20133 Italy
2. STMicroelectronics Via Camillo Olivetti, 2 Agrate Brianza MB 20864 Italy
Publisher
Wiley
Subject
Mechanical Engineering,Mechanics of Materials
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1002/admi.202202183
Reference56 articles.
1. A review of printed passive electronic components through fully additive manufacturing methods
2. Fully printed electronics on flexible substrates: High gain amplifiers and DAC
3. Fully-Additive Printed Electronics: Transistor model, process variation and fundamental circuit designs
4. A Review on Aerosol-Based Direct-Write and Its Applications for Microelectronics
5. Aerosol Jet® Direct-Write for Microscale Additive Manufacturing
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