Interaction Forces Between Silica Particles and Wafer Surfaces during Chemical Mechanical Planarization of Copper-Reference-Cited by-同舟云学术

Interaction Forces Between Silica Particles and Wafer Surfaces during Chemical Mechanical Planarization of Copper

Published:2003 Issue:5 Volume:150 Page:G327
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

Lee Su-Youn,Lee Sang-Ho,Park Jin-Goo

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference12 articles.

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4. A. W. Adamson and A. P. Gast,Physical Chemistry of Surfaces, pp. 250-276, John Wiley & Son, Inc., New York (1997).

5. R. J. Stokes and D. F. Evans,Fundamentals of Interfacial Engineering, p. 145, Wiley-VCH, Inc., New York (1997).

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