1. P. Renteln, S. Srivatsan, and K. Y. Ramanujam, inProceedings of the 2003 CMP-MIC, IMIC, pp. 344-348 (2003).
2. Three-dimensional wafer-scale copper chemical–mechanical planarization model
3. J. Sorooshian, D. DeNardis, L. Charns, Z. Li, D. Boning, F. Shadman, and A. Philipossian, inProceedings of the 2003 CMP-MIC, IMIC, pp. 43-50 (2003).
4. An Exploration of the Copper CMP Removal Mechanism
5. L. Borucki, L. Charns, and A. Philipossian, Abstract 918, The Electrochemical Society Meeting Abstracts, Vol. 2003-2, Orlando, FL, Oct 12-16, 2003.