Author:
Long John G.,Searson Peter C.,Vereecken Philippe M.
Publisher
The Electrochemical Society
Subject
Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials
Reference32 articles.
1. Copper-Based Metallization in ULSI Structures: Part II: Is Cu Ahead of Its Time as an On-Chip Interconnect Material?
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3. Leveling and Microstructural Effects of Additives for Copper Electrodeposition
4. H. Deligianni, J. Horkans, K. Kwietniak, J. O. Dukovic, P. C. Andricacos, S. Boettcher, S.-C. Seo, P. Locke, A. Simon, S. Seymour, and S. Malhotra , inElectrochemical Processing in ULSI Fabrication III, P. C. Andricacos , P. C. Searson , C. Reidsema-Simpson , P. Allongue , J. L. Stickney , and G. M. Oleszek , Editors, PV 2000-8, p. 145, The Electrochemical Society Proceedings Series, Pennington, NJ (2000).
Cited by
58 articles.
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