1. 1) Y. Tsukada, “Introduction of build-up circuit board”, pp.101-116 (2000) Nikkan Kogyo Shimbun Ltd.
2. 2) T. Mori, “Super low thermal expansion curable polyamide insulating resin”, Japan Institute of Electronics Packaging, Vol.10, No.2, pp.116-119 (2007).
3. 3) Y. Mutoh, I. Sakamoto and T. Matuuki, “Effect of wisker content on tensile strength and fracture toughness in glass-wisker reinforced polyamide 6.6”, Transactions of the Japan Society of Mechanical Engineering, Vol.56, No.523, pp.416-423 (1990).
4. A study of the mechanical behaviour of a glass fibre reinforced polyamide 6,6: Experimental investigation