High-Frequency Parametric Study of Electroplated Conductive Filaments in 3D Printed Microwave Topologies-Reference-Cited by-同舟云学术

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High-Frequency Parametric Study of Electroplated Conductive Filaments in 3D Printed Microwave Topologies

Published:2023-11-07 Issue: Volume: Page:
ISSN:2329-7662
Container-title:3D Printing and Additive Manufacturing
language:en
Short-container-title:3D Printing and Additive Manufacturing

Author:

Salazar Rolando¹,Vasquez Dreidy²,Hermosilla Gabriel¹,Rajo-Iglesias Eva³,Pizarro Francisco¹^ORCID

Affiliation:

1. Escuela de Ingeniería Eléctrica, Pontificia Universidad Católica de Valparaíso, Valparaíso, Chile.

2. Escuela de Ingeniería Química, Pontificia Universidad Católica de Valparaíso, Valparaíso, Chile.

3. Department of Signal Theory and Communication, University Carlos III of Madrid, Madrid, Spain.

Publisher

Mary Ann Liebert Inc

Subject

Industrial and Manufacturing Engineering,Materials Science (miscellaneous)

Link

https://www.liebertpub.com/doi/pdf/10.1089/3dp.2023.0074

Reference47 articles.

1. 3D-printing technologies for electrochemical applications

2. 3D Printing for the Rapid Prototyping of Structural Electronics

3. 3D Printed Electronics With High Performance, Multi-Layered Electrical Interconnect

4. A review on 3D micro-additive manufacturing technologies

5. Design and development of a multimode waveguide corrugated horn antenna using 3D printing technology and its comparison with aluminium‐based prototype

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