Application of Ag@Cu Water-Based Nanomaterial Conductive Ink in 3D Printing-Reference-Cited by-同舟云学术

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Application of Ag@Cu Water-Based Nanomaterial Conductive Ink in 3D Printing

Published:2022-06-14 Issue: Volume: Page:
ISSN:2329-7662
Container-title:3D Printing and Additive Manufacturing
language:en
Short-container-title:3D Printing and Additive Manufacturing

Author:

Zhao Chenfei¹,Wang Jun¹^ORCID,Zhang Zhuoqing¹,Qian Bo²

Affiliation:

1. College of Bioresources Chemical and Materials Engineering, Shaanxi University of Science and Technology, Xi'an, People's Republic of China.

2. Inkjet Printing Public Platform, Suzhou Institute of Nano-tech and Nano-bionics, Chinese Academy of Sciences, Suzhou, People's Republic of China.

Publisher

Mary Ann Liebert Inc

Subject

Industrial and Manufacturing Engineering,Materials Science (miscellaneous)

Link

https://www.liebertpub.com/doi/pdf/10.1089/3dp.2021.0199

Reference15 articles.

1. Copper pastes using bimodal particles for flexible printed electronics

2. Surface effect induced Cu-Cu bonding by Cu nanosolder paste

3. Synthesis of silver nanoparticles using the polyol process and the influence of precursor injection

4. Printed electronics: the challenges involved in printing devices, interconnects, and contacts based on inorganic materials

5. Matrix-Assisted Catalytic Printing for the Fabrication of Multiscale, Flexible, Foldable, and Stretchable Metal Conductors

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Study on the Technology and Properties of Green Laser Sintering Nano-Copper Paste Ink;Nanomaterials;2024-08-31

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