Copper pastes using bimodal particles for flexible printed electronics
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Link
http://link.springer.com/content/pdf/10.1007/s10853-015-9498-7.pdf
Reference23 articles.
1. Kamyshny A, Magdassi S (2014) Conductive nanomaterials for printed electronics. Small 10(17):3515–3535. doi: 10.1002/smll.201303000
2. Jung M, Kim J, Noh J, Lim N, Lim C, Lee G, Kim J, Kang H, Jung K, Leonard AD, Tour JM, Cho G (2010) All-printed and roll-to-roll-printable 13.56-MHz-operated 1-bit RF tag on plastic foils. IEEE Trans Electron Devices 57(3):571–580. doi: 10.1109/TED.2009.2039541
3. Willmann J, Stocker D, Dörsam E (2014) Characteristics and evaluation criteria of substrate-based manufacturing. Is roll-to-roll the best solution for printed electronics? Org Electron 15(7):1631–1640. doi: 10.1016/j.orgel.2014.04.022
4. Yim MJ, Li Y, Moon KS, Wong C (2007) Oxidation prevention and electrical property enhancement of copper-filled isotropically conductive adhesives. J Electron Mater 36(10):1341–1347
5. Scherer J, Vogt M, Magnussen O, Behm R (1997) Corrosion of alkanethiol-covered Cu (100) surfaces in hydrochloric acid solution studied by in situ scanning tunneling microscopy. Langmuir 13(26):7045–7051
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